Lasers viable for mass production. The problem with

Lasers in Material Processing

 

Ashok Kumar Pasumarthi

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Department of Engineering
Technology, Middle Tennessee State University

 

Abstract

This paper
will explain the use of lasers in electronic device fabrication and material
processing of ceramics. In machining of electronic devices and micro-patterning
of multilayers with less chip production and no post process, which can be
obtained by the advent of ultra-fast lasers. This ultra-fast laser is viable
for mass production. The problem with machining of Ceramics like glass is
ablation and evaporation of material. LAMPP means laser assisted microwave
Plasma Processing is used to overcome the drawbacks of previous conventional
methods and enable sintering of materials without ablation of the surface.

 

Introduction

When
machining transparent material like glass and electronic displays the machining
process should not spoil the optical and structural properties and reduce the
number of post-machining processes, that means the final output is generated in
one process only. This can be achieved by using different laser material
processing techniques like LAMPP and ultra-fast laser machining. The CO2 laser has got
promising features which makes the machining a very easy and give good optical
and structural properties to the ceramics. CO2 laser annealing
decreases the scattering losses of glass and can produce rare earth materials
in glass composites.

 

Fabrication
of Transparent Glass using CO2 laser

Fig 1.

 

 

Crystallization
of glass depends on composure and viscosity of glass, the solubility of elements, thermal exposure. The
experimental setup is shown in figure1. The parameters of the CO2 laser are setup to get the required properties of the materials. The diameter was 6mm and
power density is 5.7w/cm2 and wave-guides are 2cm in diameter. Argon
gas used as shroud gas for annealing composites. 1

 

Sintering
and melting of ceramic composites by LAMPP

Fig 2

 

The main
reason for combining laser and microwave plasma is to produce the very high amount of heat at a concentrated
point so that the ceramic materials can be sintered or melted effectively,
without leaving irregular surfaces and ablation of material. The figure shows
the setup. The laser beam is aligned to
the position of maximum microwave field strength in the process chamber to
intensify the machining process. 2

 

 

 

 

 

Micro-machining
of Transparent electronic materials

Brittle
materials like glass, ceramics cannot be machined using tools because of
chipping and cracking ultrafast laser micro-machining helps decrease the heat
affected damage and breakage and leaving fine surface-finish to the material.
In wearable electronic devices, the
challenging aspect is a fabrication of
transparent electrodes, which is can be easily done by ultrafast laser
patterning. 3

 

Conclusion

This paper
gives a clear understanding of using lasers in machining of ceramic materials.
LAMPP is the latest method for machining
of ceramic substances. Ultra-fast lasers are adopted in machining of softer and
sensitive electronic devices.

 

References

Glass-ceramics for
photonics: Laser material processing

http://ieeexplore.ieee.org.ezproxy.mtsu.edu/xpls/icp.jsp?arnumber=7193488

Additive manufacturing
of ceramic composites by laser assisted
microwave plasma processing, LAMPP

http://ieeexplore.ieee.org.ezproxy.mtsu.edu/xpls/icp.jsp?arnumber=7167050

Ultrafast laser
materials processing for manufacturing innovation

http://ieeexplore.ieee.org.ezproxy.mtsu.edu/xpls/icp.jsp?arnumber=7375813&tag=1